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1. List of Abbreviations
2. Introduction
3. Intel® Agilex™ FPGA Package Mechanical Design
4. Intel® Agilex™ FPGA Thermal Design Parameters
5. Thermal Design Process for Intel® Agilex™ Devices
6. Power and Thermal Calculator (PTC) for Intel® Agilex™ Devices
7. Example 2—Alternative Method of Analyzing Thermal Design
8. Document Revision History for AN 944: Thermal Modeling for Intel® Agilex™ FPGAs with the Intel® FPGA Power and Thermal Calculator
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6.1. Device Selection and Analysis Example
This section illustrates the setting of Intel® FPGA Power and Thermal Calculator (PTC) parameters for an example thermal analysis of a PCIe board. The first step in the design process is to select an FPGA device.
For the purpose of this example, choose a AGFA014R24A Intel® Agilex™ device, which has E and P transceiver tiles in addition to the core die.
Feature | Value | Comment |
---|---|---|
Family | Intel® Agilex™ | |
Device | AGFA014R24A | Intel® Agilex™ FPGA with P and E tiles. |
Package | R24A | 47x36mm BGA package |
Device Grade | Extended -1 standard power | |
Transceiver Grade | P1 |
Figure 6. Top View of AGFA014R24A with Integrated Heat Spreader (IHS) Removed