Article ID: 000074177 Content Type: Troubleshooting Last Reviewed: 08/18/2023

Do the package changes or other changes described in Intel® Product Discontinuation Notice PDN1926 change the thermal characteristics of the affected devices?

Environment

  • Intel® Quartus® Prime Pro Edition
  • BUILT IN - ARTICLE INTRO SECOND COMPONENT
    Description

    No. Intel® PDN1926 provides notification of changes for several device families:

    • Arria® II GX
    • Arria® V
    • Stratix® III
    • Stratix® IV

    For the Arria V and Stratix III devices, the package changes from a lidless package to a molded thermal composite package that is also lidless. These changes do not affect the thermal performance of the devices, and their thermal resistance specifications are unchanged.

    The figure shows the lidless package (N) and the molded thermal composite package (G). Note that both packages feature direct thermal contact with the die.

    Resolution

    These changes do not affect the thermal performance of the devices, and their thermal resistance specifications are unchanged.  

    Related Products

    This article applies to 4 products

    Arria® V FPGAs and SoC FPGAs
    Stratix® IV FPGAs
    Stratix® III FPGAs
    Arria® II GX FPGA