Intel® Agilex™ FPGA Development Kits

Intel offers a wide selection of Intel® Agilex™ development kits to accelerate the FPGA design process. FPGA and SoC FPGA designs are offered in table top and PCIe form factors enabling general purpose broad market needs. Several connector interfaces are supported for transceivers and FPGA workloads to meet the broad application needs. On-board memory, memory upgrades with HPS enabled hardware options are provided. Covers Intel® Agilex™ F- Series, I- Series, and M-Series FPGA and SoC FPGA Development Kits.

Intel® Agilex™ FPGA Development Kits

Intel® Agilex™ F- Series Development Kits

Development Kit Features and Form Factor Interfaces
Intel Agilex F-Series FPGA Dev Kit (P-Tile & E-Tile)

HPS Hardware Enabled

3x DDR4 DIMM sockets

1x DDR4 DIMM HPS

1x DDR4 Module

PCIe, ¾ length, full height, dual width

P-Tile : PCIe 4.0 x16, edge fingers

E-Tile : 2x QSFPDD

2x 28/58G

Intel Agilex F-Series Transceiver-SoC Dev Kit (P-Tile & E-Tile)

HPS Enabled (HW & SW) 

On-board DDR4 memory (8GB)
SODIMM interface

8GB DDR4 SODIMM module

Tabletop

P-Tile : PCIe 4.0 x16, Root port connector

E-Tile : 4 ch to MXP, 4 ch to QSFP28

8 Ch to QSFPDD

Intel Agilex F-Series FPGA Dev Kit (2x F-Tile)

HPS Hardware Enabled

only supports PCIe G4 x8 on ES version Dev kit

2x DDR4 DIMM sockets

1x DDR4 Component HPS

PCIe, ¾ length, full height, dual width

F-Tile 2 : PCIe 4.0 x16, edge fingers

4 ch to MCIO

4 ch to QSFP-56 ,8 Ch to QSFPDD-56

Intel® Agilex™ I- Series Development Kits

Development Kit Features and Form Factor Interfaces

Intel Agilex I-Series FPGA Dev Kit (3x R-Tile & 1x F-Tile)

2x DDR4 DIMMs sockets

2x 8GB SR DDR4 Component

PCIe, ¾ length, full height, dual width

R-Tile : PCIe 5.0 x16, edge fingers & MCIO

F-Tile : 2x QSFPDD, 2x 28/56G

Intel Agilex I-Series Transceiver-SoC Dev Kit (4x F-Tile)

HPS Hardware Enabled

2x DDR4 DIMMs sockets

8GB DDR4 Component

Tabletop 

F-Tile : QSFP 800, 2x FMC+, 3x MXP, MCIO, USB-C, BNC