Mobile Intel® HM370 Chipset

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Technical Specifications

Technical Specifications

Essentials

Status
Launched
Product Collection
Intel® 300 Series Mobile Chipsets
Launch Date
Q2'18
Vertical Segment
Mobile
Bus Speed
8 GT/s
Lithography
14 nm
TDP
3 W
Supports Overclocking
Yes

Supplemental Information

Embedded Options Available
Yes

Memory Specifications

# of DIMMs per channel
2

Intel® Clear Video Technology
Yes
# of Displays Supported ‡
3

Expansion Options

PCI Support
NO
PCI Express Revision
3.0
PCI Express Configurations ‡
x1, x2, x4
Max # of PCI Express Lanes
16

I/O Specifications

# of USB Ports
14
USB Configuration
8 Total USB 3.1 Ports
- Up to 4 USB 3.1 Gen 2 Ports
- Up to 8 USB 3.1 Gen 1 Ports
14 USB 2.0 Ports
USB Revision
3.1/2.0
Max # of SATA 6.0 Gb/s Ports
4
RAID Configuration
0/1/5/10
Integrated LAN
Integrated MAC
Integrated Wireless‡
Intel® Wireless-AC MAC

Package Specifications

Package Size
25mm x 24mm

Advanced Technologies

Intel® Optane™ Memory Supported ‡
Yes
Intel vPro® Platform Eligibility ‡
No
Intel® ME Firmware Version
12
Intel® HD Audio Technology
Yes
Intel® Rapid Storage Technology
Yes
Intel® Rapid Storage Technology enterprise
No
Intel® Smart Sound Technology
Yes

Security & Reliability

Intel® Trusted Execution Technology ‡
No
Reviews

Reviews

Drivers and Downloads
Related Materials

Related Materials

Product and Performance Information

This feature may not be available on all computing systems. Please check with the system vendor to determine if your system delivers this feature, or reference the system specifications (motherboard, processor, chipset, power supply, HDD, graphics controller, memory, BIOS, drivers, virtual machine monitor-VMM, platform software, and/or operating system) for feature compatibility. Functionality, performance, and other benefits of this feature may vary depending on system configuration.