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Introducing the latest 3^rd Generation Intel® Xeon® Scalable processors. Built to meet the toughest challenges from the edge to the cloud. What will you solve?

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<script>var isTargetEnabled =false;</script>

<script type="text/javascript">
    var cq_tms = {
        
        wa_industry_type: "",
        wa_partner_prog: "",
        wa_subject: "",
        wa_biz_size: "",
        wa_emt_org: "",
        wa_emt_intel: "",
        wa_partner_type: "",
        wa_programidentifier: "",
        wa_location: "xa",
        wa_language: "en",
        wa_english_title: "Intel | Data Center Solutions, IoT, and PC Innovation",
        wa_content_type: "",
        wa_intel_platform: "",
        wa_applications: "",
        wa_local: "en_XA",
        wa_intel_technology: "",
        wa_system_type: "",
        wa_product_name: "",
        wa_audience: "",
        wa_life_cycle: "",
        wa_cq_url: "/content/www/xa/en/homepage.html",
        wa_page_type_micro: "mf-homepage-rwd",
        wa_env: "prd",
        wa_cq_pub_env: "publish",
        wa_transl_status: "",
        wa_product_id: "",
        wa_software: "",
        wa_reference_design: "",
        wa_codename: "",
        wa_created_date: "1346134964028",
        wa_modifed_date: "1620966534673",
        wa_off_time: "1609459200000",
        wa_ownedby: "emtorganizationalstructure:smgsalesandmarketinggroup/smgcxssmgcustomerexperienceandscalegroup",
        wa_managedby: "emtorganizationalstructure:smgsalesandmarketinggroup/smgcxssmgcustomerexperienceandscalegroup",
        wa_idz_nid : "",
        wa_event_type: "",
        wa_idz_custom_tags: "",
        wa_programming_language: "",
        wa_skill_level: "",
        wa_solution: "",
        wa_product_formFactor: "",
        wa_operating_system: "",
        wa_marketing_products: "",
        wa_ssg_third_party_prod_sys_sol: "",
        wa_upeNamespace: "",
        
        wa_secondary_content_type: ""

};

cq_tms.wa_tms_sync_load = "deferred";
    
</script>

<script type="text/javascript" src="/content/dam/www/global/wap/tms.sync.js" async></script>

<link rel="stylesheet" href="/etc.clientlibs/settings/wcm/designs/ver/210506/intel/clientlibs/pages/commons-page.min.css" type="text/css"><script src="/etc.clientlibs/settings/wcm/designs/ver/210506/intel/clientlibs/pages/commons-page.min.js" defer></script>

<script>!function(){var e=setInterval(function(){"undefined"!=typeof $CQ&&($CQ(function(){CQ_Analytics.SegmentMgr.loadSegments("/etc/segmentation"),CQ_Analytics.ClientContextUtils.init("/etc/clientcontext/intel",window.location.pathname.substr(0,window.location.pathname.indexOf(".")))}),clearInterval(e))},100)}();</script>

<link rel="stylesheet" type="text/css" href="/etc.clientlibs/settings/wcm/designs/intel/xa/en/css/resources/css/intel.rwd.override.css"/>