Autonomous Driving and Advanced Driver Assistance Systems (ADAS)
The Autonomous Driving and ADAS segments are undergoing a metamorphosis, driving complex requirements for compute and sensing capabilities. In order to stay on the cutting-edge of this competitive landscape, automotive system-design engineers need to engineer the right computing architectures. FPGAs provide a unique advantage over other silicon solutions and are ideal to meet the evolving requirements in the Autonomous Driving industry.
|Performance and Efficiency||To enable advanced features and increasing processing requirements with low-power consumption|
|Real-Time Processing||To enable data processing and decision making in real time|
|Safety and Security||To protect against cyber attacks and ensure functional safety of the vehicle|
I/O Hub and Sensor Ingest
As the level of driving automation evolves from ADAS L1 to Fully Autonomous Driving L5, the number of sensors required and the need to process sensor data will increase exponentially. Proliferation of sensors used to provide a comprehensive 3D perception of surroundings for both safety and convenience, and adoption of image sensors with higher resolution, pixel depth and frame rate would require multiple communication interfaces and high data bandwidth.
Intel® FPGA can provide the ideal solution that meets the flexible IO and high data rate requirements of these systems. FPGAs can aggregate the data from multiple sensors (with different types of interfaces, data rates and so on) and convert them into a unified format (e.g. MIPI CSI-2) for output to the compute element further down the AD System.
LiDAR sensor units are becoming ubiquitous for the AD applications. Different architectures are emerging ranging from basic signal processing in the LiDAR sensor on the edge to more advanced features such as fusion and machine learning being implemented in the LiDAR unit. Intel® FPGA can provide the flexibility and scalability to address the signal processing, data fusion and complex parallel processing tasks this application requires.
FPGAs can manage the secure data handling policy for an autonomous driving system, which can be reconfigured to adapt to changing requirements.
To build your own security functions, take advantage of the state-of-the-art features on the FPGA including secure boot, secure key storage, cryptographic acceleration, secure lock, unique device ID, secure debug, and physical tamper detection and protection.
Trends in In-Vehicle Experience (IVE)
Consumers expect to interact with their in-vehicle infotainment system in a similar way to how they interact with their smart phones, tablets and gaming systems. Additionally, new driver assisting functions continue to be integrated into the traditional infotainment system. Increasingly powerful SoC’s and components such as FPGAs are required to develop new ECUs to implement the functions and features that enable auto makers to keep up with the latest consumer and safety trends.
Within the infotainment system, the trends we are seeing are:
- Visual data (more displays, higher resolutions, unique surfaces, projection-based systems)
- Unique features such as gesture, speech and voice recognition, Driver Monitoring System, Lane Departure Warning and Blind Spot Detection
Intel FPGAs are enabling designers to set the trends in IVE and enable the design of advanced systems with unique features. With the evolution of the In-Vehicle Experience, it’s now all about the ride!
|CAN||Bosch, CAST, IFI|
|DisplayPort||Intel FPGA IP|
|OpenLDI (LVDS)||Intel FPGA IP - ALTLVDS, SoftLVDS|
|PCI Express* (PCIe* )||Intel® FPGA IP Hard IP (select devices)|
|USB 3.0||SLS Corp.|
|Video and Image Processing (VIP) Suite
||Intel (suite of 18 video and image processing IP)|
|2D/3D Graphics, HMI, Video IO||TES|
|Video and Graphics||Imagem Technology|
Functional safety has long been a key strategic imperative for us, and Intel was the first FPGA supplier to achieve IEC 61508 functional safety certification for the industrial market. That early commitment and investment has put us in a leading position to execute on our ISO 26262 functional safety plan for automotive applications.
Intel is an active member of the ISO 26262 working group and our functional safety manager co-chairs the ISO 19451 PLD sub group, which helps to drive PLD requirements into the 2nd edition of the ISO 26262 standard.
Intel’s Leadership in Functional Safety Expands to ISO 26262
The automotive industry is adding multiple active safety systems to reduce the risk of injury and harm. Adapted from the IEC 61508 functional safety standard, the ISO 26262 automotive electronic system safety standard helps you avoid systematic faults and also detect, control, and mitigate any random hardware faults that may cause a malfunction of the system.
To simplify and speed up your certification process, we are working with TÜV Rheinland, an independent third-party assessor specializing in functional safety testing and certification, to receive qualification to ISO 26262. Intel is the first FPGA supplier whose FPGA devices, diagnostics IP, development tools, and FPGA design flow are all certified for the IEC 61508 functional safety standard. Our Functional Safety Data Pack (FSDP) typically saves customers 12-18 man months in certifying their safety applications.
Safety Package Development Timeline Comparison
Intel’s Cyclone® V SoC family will be the first family qualified for ISO 26262 with our Automotive Functional Safety Data Pack (AFSDP). A detailed safety manual and general FMEDA application note are available now to start your design along with a suite of diagnostics IP. Additionally, we are developing a detailed FMEDA calculator tool to support required hardware architectural metric calculations. Audit and certification for ISO 26262 are scheduled for mid-2015 with the release of the AFSDP in January 2016 for Cyclone V SoC family.
Intel’s functional safety approach is a holistic one, which provides guidance in methodology, backed up with qualified tools that increase your tool confidence and may eliminate the use of redundant tool chains. Next, we offer a safety-ready suite of diagnostics IP and expert technical support along with our certified PLDs. Functional safety documentation, reliability reports, and our TÜV certificate will assist you in the certification of your systems.
|Resource||Title / Description|
|White Paper Nov. 2013||A Safety Methodology for ADAS Designs in FPGAs (PDF)|
|Article 2012||Automotive Electric Systems - a View of the Future|
|Website||IEC 61508 – Industrial Functional Safety and the FSDP|
Intel® automotive-grade devices meet or exceed ISO 9001:2001 and AEC-Q100 standards. All Intel® automotive-grade devices are manufactured at fully TS-16949-registered/certified sites using some of programmable logic industry’s smallest, highest reliability, and mainstream semiconductor fabrication processes. Our automotive-grade portfolio spans FPGAs, ARM-based SoCs, CPLDs, as well as the smallest form factor power regulator PowerSoCs.
Automotive-grade Intel® Enpirion® power management products are ideally suited for powering automotive-grade programmable logic devices and other automotive sub-system circuits. These highly integrated devices combine high efficiency and a tiny footprint to maximize power density while minimizing heat. With a 45,000 years mean time between failures (MTBF), Intel Enpirion Power Solutions are built to meet automotive reliability requirements.
|Product||IOUT (A)||VIN Range (V)||VOUT Range (V)||Package||FSW (MHz)||Size (mm2)|
|EN6310QA||1.0||2.7 to 5.5||0.6 to 3.3||QFN30||2.2||65|
|EN6337QA||3.0||2.5 to 6.6||0.75 to (VIN - VDROPOUT)||QFN38||1.9||75|
|EN6347QA||4.0||2.5 to 6.6||0.75 to (VIN - VDROPOUT)||QFN38||3.0||75|
|EN6360QA||8.0||2.5 to 6.6||0.60 to (VIN - VDROPOUT)||QFN60||1.2||190|
|EN63A0QA||12.0||2.5 to 6.6||0.60 to (VIN - VDROPOUT)||QFN76||1.2||225|
Notes: Other devices maybe available for automotive qualification upon requests.
Enpirion Power Solution Key Features:
- AEC-Q100 qualified
- -40°C to +105°C Ambient Temperature (125°C Junction Temp.)
- PPAP available
- 45,000 years MTBF
- Integrated MOSFETs, inductor, and capacitors enable tiny footprint
- High efficiency reduces power loss and heat
- Easy to use with minimal components