Thermal mechanical components
For the Intel® Core™ i3 processor with thermal design power of 65W.
Suppliers of support components have developed products for Intel® Core™ i3 processor family based system designs. The listed vendors supply support components for processors in 1155-Land LGA package. Some vendor products may follow design guidelines listed on the technical documents page.
Intel-enabled vendors
This section includes supplier information for Intel-enabled vendors for the Intel Core i3 processor. These suppliers may produce both Intel-enabled and non-Intel-enabled solutions.
Note: End-users are responsible for the verification of the component offerings with the supplier. OEM and system integrators are responsible for thermal, mechanical, and environmental validation of these solutions.
LGA 1155 socket and ILM components
| Supplier | Part description | Intel part number | Contact | Phone | |
|---|---|---|---|---|---|
| Foxconn* | LGA1155 Socket LGA115x ILM with Cover LGA115x ILM without Cover LGA115x ILM Cover Only Back Plate (with screws) |
E52846-002 G11449-001 E36142-002 G12451-001 E36143-002 |
Julia Jiang | +1-408-919-6178 | juliaj@foxconn.com |
| Lotes* | LGA115x ILM with Cover LGA115x ILM without Cover LGA115x ILM Cover Only Back Plate (with screws) |
G11449-001 E36142-002 G12451-001 E36143-002 |
Windy Wong | +1-604-721-1259 | windy@lotestech.com |
| Molex* | LGA1155 Socket LGA115x ILM with Cover LGA115x ILM without Cover LGA115x ILM Cover Only Back Plate (with screws) |
E52846-002 G11449-001 E36142-002 G12451-001 E36143-002 |
Carol Liang | +86-21-504-80889 x3301 |
carol.liang@molex.com |
| Tyco* | LGA1155 Socket LGA115x ILM with Cover LGA115x ILM without Cover LGA115x ILM Cover Only Back Plate (with screws) |
E52846-002 G11449-001 E36142-002 G12451-001 E36143-002 |
Billy Hsieh | +886-2-8768-2788 x617 | billy.hsieh@te.com |
| ITW Fastex* | LGA115x ILM without cover LGA115x ILM Back Plate (with screws) |
E36142-002 E36143-002 |
Chak Chakir | +1-512-989-7771 | chak.chakir@itweba.com |
Heatsinks for Intel® Core™ i3 processors with thermal design power of 65W
| Supplier | Part description | Intel part number | Contact | Phone | |
|---|---|---|---|---|---|
| Nidec* | Intel® RCFH7-115x Reference Heatsink (DHA-A) Intel® RCFH6-115x Reference Heatsink (DHA-B) |
E41759-002 E41997-002 |
Karl Mattson | +1-360-666-2445 | karl.mattson@nidec.com |
| Delta* | Intel® RCFH7-115x Reference Heatsink (DHA-A) Intel® RCFH6-115x Reference Heatsink (DHA-B) |
E41759-002 E41997-002 |
Jason Tsai | +1-503-533-8444 x111 +1-503-539-3547 |
jtsai@delta-corp.com |
| Foxconn* | Intel® RCFH7-115x Reference Heatsink (DHA-A) Intel® RCFH6-115x Reference Heatsink (DHA-B) |
E41759-002 E41997-002 |
Julia Jiang | +1-408-919-6178 | juliaj@foxconn.com |
Fasteners
| Supplier | Part description | Intel part number | Contact | Phone | |
|---|---|---|---|---|---|
| ITW Fastex* | Fastener | Base: C33389 Cap: C33390 |
Chak Chakir | +1-512-989-7771 | chak.chakir@itweba.com |
Alternate support components
The following suppliers have developed cooling solutions for the Intel Core i3 processor-based system designs. These were independently tested by an Intel-enabled, third-party test house. These suppliers may produce both compliant and non-compliant solutions in addition to what is listed below. Please regularly consult this page for updated information on heatsink vendor status.
Note: End-users are responsible for the verification of the component offerings with the supplier. OEM and system integrators are responsible for thermal, mechanical, and environmental validation of these solutions.
Heatsinks for Intel Core i3 processors with thermal design power of 65W
These heatsinks were tested for compliance to thermal, mechanical, and PWM requirements.
| Supplier | Intel part number | Contact | Phone | |
|---|---|---|---|---|
| Akasa Asia Corp.* | AK-CC067 | Yiyen Chen | 886-2-2999-6289 | sales@akasa.com.tw |
| AVC* | Z8UL06L002 | Kai Chang | +86-755-33668888-x63588 | kai_chang@avc.com.tw |
| AMA* | 90-ZBC258306 | Doris Yu | +886-952-083222 | doris_yu@amatech.com |
| Cooler Master* | ECC-S0782-01-GP | Barkley | +886-918539632 | barkley_hsaing@coolermaster.com.tw |
| Dynatron* | K786 | Ian Lee | +1-510-498-8888-x116 | ian@dynatron-corp.com |
These heatsinks were tested for compliance to thermal and mechanical requirements.
| Supplier | Intel part number | Contact | Phone | |
|---|---|---|---|---|
| Thermaltake* | CLP0550 | Sean Li | +886-2-26626501-x235 +886-922036128 |
sean@thermaltake.com.tw |
| Kwo Ger Metal Technology, Inc* | 0772-0421R | Rosewire Kuo | +886-2-26832868-x173 | rosewire@kwoger.com.tw |
