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Quantum Leap in Business Agility, Data Center Efficiency, IT Value

Solution Brief: Refresh existing infrastructure and accelerate data center ROI with Microsoft Windows Server 2008 R2* and Intel® Xeon® processors.  

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Red Hat, Intel Create Secure, Reliable, and Scalable Performance

Solution Brief: Red Hat Enterprise Linux 6* for the Intel® Xeon® processor E7 family outlines scalability, security, and cost features.

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Intel® Socket Test Technology for LGA771

This document includes the theory on which Intel® Socket Test Technology is based, typical test methods, and device specification for LGA771.

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The ProLiant DL980 G7* server based on the Intel® Xeon® processor E7 family continues to be the number one performance leader on the two-tier SAP Sales and Distribution (SD) standard application benchmark with the latest Microsoft SQL Server eight-processor Windows* performance result.

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Intel's Packaging Databook Chapter 2: Package/Module/PC Card Outlines

Chapter 2 Package / Module / PC Card Outlines and Dimensions: A detailed view of Intel package outlines and dimensions.

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Intel's Packaging Databook Chapter 3: Alumina and Leaded Molded Technology: Packaging

Packaging Databook, Ch. 3: packaging technologies for assembling three types of component packages for alumina and leaded molded technology.

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Intel's Packaging Databook Chapter 4: IC Packages Performance Characteristics: Packaging

Packaging Databook, Ch. 4: basic package modeling terminology, methodology, and experimental characterization, and modeled data for the packages.

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Intel's Packaging Databook Chapter 5: Physical Constants of IC Package Materials

2000 Packaging Databook, Chapter 5: Physical constants of IC package materials.

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Intel's Packaging Databook Chapter 6: ESD/EOS

Packaging Databook, Ch. 6: Electrical static discharge and electrical over stress.

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Intel's Packaging Databook Chapter 7: Leaded Surface Mount Technology (SMT)

Packaging Databook Ch 7: leaded surface mount technology enables more reliable assemblies with higher I/O, board density, and less weight and cost.

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