The Intel® 845MP and Intel® 845MZ chipsets are designed, validated and optimized for the Mobile Intel® Pentium® 4 Processor - M. The Intel® 845MP Chipset supports external graphics and Intel® 845MZ Chipset is optimized for value systems.
These platforms deliver the benefits of Intel® quality, reliability and stability that businesses need to deploy mobile computers with maximum ROI and performance headroom for the future. The ICH3-M (82801 CAM I/O Controller Hub 3) makes a direct connection to 845MP/MZ for smoother and faster access to peripherals, providing more benefit for extended PC usage models. Additionally, the chipset uses Intel's advanced mBGA packaging and supports 6 USB ports.
Chipset Diagram
Product information
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| Features and benefits | |
|---|---|
| 400MHz System Bus | Delivers a high-bandwidth connection between the Mobile Intel® Pentium® 4 processor - M and the platform |
| Intel® I/O Hub architecture | Provides a high bandwidth (266MB/s) I/O pipe that delivers fast communications and reduces latency time for I/O operations. |
| DDR 200/266 MHz SDRAM | Choice of memory technology to support a full range of price/performance requirements up to 1GB. DDR memory offers high reliability and consumes minimal power, critical to the mobile PC platform |
| AGP4X interface | Enables over 1 GB/s of graphics bandwidth interface for high-quality 2D, 3D, and video streams |
| Enhanced Intel Speedstep® Technology | Real-time dynamic switching of voltage and frequency between maximum performance and battery-optimized operation, based on CPU demand, for longer battery life |
| Deeper Sleep Alert State | Dynamic power management mode operates at 66% lower voltage than Deep sleep mode for longer battery life |
| Advanced Power Management | Supports ACPI 2.0 compliant for the latest power management and legacy power management with APM 1.2 compliant. |
| Ultra ATA/100 | Takes advantage of industry innovations in HDD features and performance |
| Latest AC97 Controller | Excellent audio quality, with up to six channels for full surround sound capability including a simultaneous modem connection |
| Thin & Small Package Technology | Intel® 845MP/MZ chipset uses Intel's Flip-Chip Ball Grid Array (FCBGA) packaging that is excellent for reducing package size and improves the chipset cooling capability. |
Technical Documents
View More Technical Documents >-
Datasheet, Intel Chipset...
Datasheet: Intel® 845 Chipset, 82845 Memory Controller Hub for SDR.
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Datasheet: Intel® 845...
Datasheet for Intel® 845 Chipset: 82845 Memory Controller Hub (MCH) for DDR
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Datasheet: Intel® Family...
Provides technical information on Intel® 845 Chipset family mobile: 82845MP/82845MZ Chipset MCH.
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Intel® 82801CA I/O...
Intel® 82801CA I/O Controller Hub 3-S: PCI bus interface, integrated LAN/IDE controllers, power...
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Intel® Processor and...
Design guide: Intel® Pentium® 4 Processor in 478-pin Package and Intel® 845 Chipset Platform for SDR.
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Update, 2004: Intel®...
Pentium® 4 Processor in 478-pin Package, Intel® 845 Chipset Platform for DDR design, schematic, layout.
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Intel® Pentium® 4,...
Intel® Pentium® 4 processor, Intel® 845 Chipset system layout, routing guidelines, power design, hub...
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Intel® Pentium® 4,...
Pentium® 4 processor in 478-pin package, Intel® 845 Chipset platform for SDR hub interface, design.
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Spec Update: Intel®...
Spec Update: 2002: Intel® 845MP/MZ Chipset Family Memory Controller Hub (MCH-M).
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