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Intel® Xeon® Processor E5-2600 v3 Product Family

The Intel® Xeon® processor E5-2600 v3 product family-based expert workstation: dual processors for optimal performance. The highest performing workstation, optimized for experts.

Structural and Thermal Simulation Using ANSYS Mechanical* V15

ANSYS Mechanical* is a structural and thermal simulation software package that leverages a full complement of nonlinear and linear elements, material laws ranging from metal to rubber, and a comprehensive set of solvers. The result is the geometric mean of the following workloads (actual performance will vary by workload): V15cg-1, V15cg-2, V15cg-3, V15ln-1, V15ln-2, V15sp-1, V15sp-2, V15sp-3, V15sp-4, and V15sp-5. The result is for a single node.

Intel internal testing as of August 2014

Intel® Xeon® processor X5690:

Intel® Software Development Platform (Intel® SDP) with Intel® Xeon® processor X5690 (3.46 GHz, 6 cores, 12 MB), Intel® Hyper-Threading Technology enabled, Intel® Turbo Boost Technology enabled, 12 x 4 GB DDR3-1333 MHz UDIMM error-correcting code (ECC), Red Hat Enterprise Linux* 6.5, 4x 7200 RPM HDD, Intel® RAID 0 with 3 GB/s LSI controller, AMD FirePro* W5000.

 

Intel Xeon processor E5-2687W v2:

Intel SDP with Intel Xeon processor E5-2687W v2 (3.4 GHz, 8 cores, 25 MB), Intel Hyper-Threading Technology enabled, Intel Turbo Boost Technology enabled, 8 x 8 GB DDR3-1866 MHz UDIMM ECC, Red Hat Enterprise Linux 6.5, 4x Intel® SSD DC S3700 Series, Intel RAID 0 with 6 GB/s LSI controller, AMD FirePro W5000.

 

Intel Xeon processor E5-2687W v3:

Intel SDP with Intel Xeon processor E5-2687W v3 (3.1 GHz, 10 cores, 25 MB), Intel Hyper-Threading Technology enabled, Intel Turbo Boost Technology enabled, 16 x 8 GB DDR4-2133 MHz UDIMM ECC, Red Hat Enterprise Linux 6.5, 4x Intel SSD DC S3700 Series, Intel RAID 0 with Intel® Rapid Storage Technology enterprise (Intel® RSTe), AMD FirePro W5000.

Additional information: 1 2 3 4

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Product and Performance Information

1

Software and workloads used in performance tests may have been optimized for performance only on Intel® microprocessors. Performance tests, such as SYSmark and MobileMark, are measured using specific computer systems, components, software, operations, and functions. Any change to any of those factors may cause the results to vary. You should consult other information and performance tests to assist you in fully evaluating your contemplated purchases, including the performance of that product when combined with other products. For more information, go to www.intel.com/performance.

2

Intel does not control or audit the design or implementation of third party benchmarks or websites referenced in this document. Intel encourages all of its customers to visit the referenced websites or others where similar performance benchmarks are reported and confirm whether the referenced benchmarks are accurate and reflect performance of systems available for purchase.

3

Intel processor numbers are not a measure of performance. Processor numbers differentiate features within each processor family, not across different processor families. See www.intel.com/content/www/xa/en/processors/processor-numbers.html for details.

4

Intel's compilers may or may not optimize to the same degree for non-Intel microprocessors for optimizations that are not unique to Intel® microprocessors. These optimizations include SSE2 and SSE3 instruction sets and other optimizations. Intel does not guarantee the availability, functionality, or effectiveness of any optimization on microprocessors not manufactured by Intel.

Microprocessor-dependent optimizations in this product are intended for use with Intel microprocessors. Certain optimizations not specific to Intel® microarchitecture are reserved for Intel microprocessors. Please refer to the applicable product user and reference guides for more information regarding the specific instruction sets covered by this notice.

Notice revision #20110804