Intel® MAX® 10 10M04 FPGA
Specifications
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Essentials
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Product Collection
Intel® MAX® 10 FPGA
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Marketing Status
Launched
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Launch Date
2014
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Lithography
55 nm
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I/O Specifications
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Maximum User I/O Count†
246
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I/O Standards Support
3.0 V to 3.3 V LVTTL, 1.0 V to 3.3 V LVCMOS, PCI, SSTL, HSTL, HSUL, Differential SSTL, Differential HSTL, Differential HSUL, LVDS, Mini-LVDS, RSDS, LVPECL, PPDS, BLVDS, TMDS, Sub-LVDS, SLVS, HiSpi
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Maximum LVDS Pairs
15
Advanced Technologies
Package Specifications
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Package Options
F256, U324, E144, M153, U169, U324
Supplemental Information
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Additional Information
Product Table (Family Comparison)
Datasheet
All FPGA Documentation
Ordering and Compliance
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Ordering and spec information
Trade compliance information
- ECCN Varies By Product
- CCATS NA
- US HTS 8542390001
PCN Information
SR7DC
- 968812 PCN
SR4DC
- 965255 PCN
SR4NM
- 965580 PCN
SR4DB
- 965254 PCN
SR4NK
- 965578 PCN
SREKW
- 983295 PCN
SR4NJ
- 965577 PCN
SR7DE
- 968814 PCN
SR7DD
- 968813 PCN
SR6GW
- 967747 PCN
SRCYZ
- 978981 PCN
SR6GZ
- 967750 PCN
SR6GY
- 967749 PCN
SRBJZ
- 973663 PCN
SRBJY
- 973662 PCN
SRBJX
- 973661 PCN
SRBJW
- 973660 PCN
SR4KU
- 965483 PCN
SR4KT
- 965482 PCN
SR4KS
- 965481 PCN
SRCYN
- 978970 PCN
SRKJF
- 99A9T7 PCN
SRKJG
- 99A9T8 PCN
SR5Z3
- 967129 PCN
SR5Z2
- 967128 PCN
SR5Z1
- 967127 PCN
SRBK1
- 973665 PCN
SRBK0
- 973664 PCN
Drivers and Software
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Latest Drivers & Software
Launch Date
The date the product was first introduced.
Lithography
Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.
Logic Elements (LE)
Logic elements (LEs) are the smallest units of logic in Intel® FPGA architecture. LEs are compact and provide advanced features with efficient logic usage.
Fabric and I/O Phase-Locked Loops (PLLs)
Fabric and IO PLLs are used to simplify the design and implementation of the clock networks in the Intel FPGA fabric, and also the clock networks associated with the IO cells in the device.
Maximum Embedded Memory
The total capacity of all the embedded memory blocks in the programmable fabric of the Intel FPGA device.
Digital Signal Processing (DSP) Format
Depending on the Intel FPGA device family, the DSP block supports different formats such as hard floating point, hard fixed point, multiply and accumulate, and multiply only.
Hard Memory Controllers
Hard memory controllers are used to enable high-performance external memory systems attached to the Intel FPGA. A hard memory controller saves power and FPGA resources compared to the equivalent soft memory controller, and supports higher frequency operation.
External Memory Interfaces (EMIF)
The external memory interface protocols supported by the Intel FPGA device.
User-Flashable Memory
User-flashable memory is a non-volatile memory resource available in some Intel FPGA device families.
Internal Configuration Storage
Intel FPGAs store configuration data either in internal configuration storage, or in external memory devices.
Maximum User I/O Count†
The maximum number of general purpose I/O pins in the Intel FPGA device, in the largest available package.
† Actual count could be lower depending on package.
I/O Standards Support
The general purpose I/O interface standards supported by the Intel FPGA device.
Maximum LVDS Pairs
The maximum number of LVDS pairs that can be configured in the Intel FPGA device, in the largest available package. Refer to device documentation for actual RX and TX LVDS pairs count by package type.
FPGA Bitstream Security
Depending on the Intel FPGA device family, various security features are available to prevent copying of the customer bitstream, and detect attempts to tamper with the device during operation.
Analog-to-Digital Converter
The analog-to-digital converter is a data-converter resource available in some Intel FPGA device families.
Package Options
Intel FPGA devices are available in different package sizes, with different IO and transceiver counts, to match customer system requirements.
All information provided is subject to change at any time, without notice. Intel may make changes to manufacturing life cycle, specifications, and product descriptions at any time, without notice. The information herein is provided "as-is" and Intel does not make any representations or warranties whatsoever regarding accuracy of the information, nor on the product features, availability, functionality, or compatibility of the products listed. Please contact system vendor for more information on specific products or systems.
Intel classifications are for general, educational and planning purposes only and consist of Export Control Classification Numbers (ECCN) and Harmonized Tariff Schedule (HTS) numbers. Any use made of Intel classifications are without recourse to Intel and shall not be construed as a representation or warranty regarding the proper ECCN or HTS. Your company as an importer and/or exporter is responsible for determining the correct classification of your transaction.
Refer to Datasheet for formal definitions of product properties and features.
‡ This feature may not be available on all computing systems. Please check with the system vendor to determine if your system delivers this feature, or reference the system specifications (motherboard, processor, chipset, power supply, HDD, graphics controller, memory, BIOS, drivers, virtual machine monitor-VMM, platform software, and/or operating system) for feature compatibility. Functionality, performance, and other benefits of this feature may vary depending on system configuration.
“Announced” SKUs are not yet available. Please refer to the Launch Date for market availability.